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Industry background

As technology advances, electronic products play an increasingly important role in our lives, from smartphones and computers to smart devices. These rely on advanced electronics manufacturing techniques. The scale and technical level of the electronics manufacturing industry continue to grow, with BGA packaging technology becoming widely used due to its high density and performance, seen in computer motherboards and smartphone chips.

Challenges and Demands in the Industry

BGA packaging technology connects circuits using solder balls arranged at the chip\'s bottom. Its advantages include high density, performance, and reliability, making it essential in electronics manufacturing. However, as its usage increases, so does the likelihood of BGA chip failures, requiring advanced rework equipment.

KAIYUN technology solutions

Seamark ZM provides intelligent BGA rework equipment, automated solder removal devices, automated ball placing machines, and laser welding equipment. These solutions cater to semiconductors, electronics manufacturing, communication equipment, and computer hardware. Seamark ZM holds a leading market share in BGA chip soldering and rework equipment.